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The global advanced packaging materials for semiconductors market was USD 34.29 billion in 2022 and is expected reach USD 59.00 billion by 2030 with a CAGR of 7.02% during the forecast period, i.e., 2023-2030. Advanced packaging materials for semiconductors refer to materials used in the assembly and packaging of semiconductor devices. These materials provide insulation, protection, and connection between semiconductor components, ensuring optimal performance and reliability. Factors driving demand for these materials include rapid technological advancements in the semiconductor industry, leading to smaller and more complex chip designs. Additionally, the proliferation of electronics in various industries, such as automotive, telecommunications, and consumer electronics, fuels the need for advanced packaging materials to enhance chip functionality and reliability; however, challenges exist for market growth. First, the development of materials that meet the stringent performance requirements of advanced semiconductor applications can be technically demanding. Second, ensuring compatibility with diverse semiconductor manufacturing processes and technologies is crucial. Third, environmental sustainability considerations and regulatory compliance pose challenges for the development and adoption of advanced packaging materials. Balancing performance, cost, and sustainability remains a critical consideration for the growth of the advanced packaging materials for semiconductors market.

In June 2023, Lam Research, American wafer fabrication equipment manufacturer, launched Coronus DX. This latest equipment from Lam Research can, in a single step, deposit a proprietary layer of protective film on both sides of the wafer edge that will help prevent defects and damage that can often occur during advanced semiconductor manufacturing. This powerful protection increases yield and enables chipmakers to implement new leading-edge processes for the production of next-generation chips and is touted as the industry’s first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications.

Browse 75 market data Tables and 45 Figures spread through 226 Pages and in-depth TOC on "Advanced Packaging Materials for Semiconductors Market, by Material Type (Silicones, Copper, Low-K Dielectric, Mold Compounds, BT Resin (Bismaleimide Triazine), Glass Interposers, and Solder Materials), by Packaging Platform (Flip Chip, Embedded Die, Fan-in Wafer Level Packaging, and Fan-out Wafer Level Packaging (FOWLP)), by End-User (Automobile, Electrical And Electronics, Power And Energy, and Other Industries), and by Region (North America, Europe, Asia-Pacific, Middle East and Africa, and South America) - Global Forecast to 2030

By material type, copper dominates the global advanced packaging materials for semiconductors market.

Based on the material type, the global advanced packaging materials for semiconductors market is segmented into silicones, copper, low-k dielectric, mold compounds, BT Resin (Bismaleimide Triazine), glass interposers, and solder Materials. Copper dominated the global advanced packaging materials for semiconductors market in 2022 owing to its excellent electrical conductivity, thermal conductivity, and cost-effectiveness. It is widely used in various packaging technologies like flip-chip bonding and through-silicon vias (TSVs). For instance, in 3D integrated circuits, copper TSVs facilitate vertical connections between stacked semiconductor layers. Its superior electrical properties and compatibility with semiconductor manufacturing processes position copper as a preferred material, driving its dominance in the global advanced packaging materials market for semiconductors.

“The Asia-Pacific (APAC) is expected to register the fastest CAGR during the forecast period in the global advanced packaging materials for semiconductors market.”

The Asia-Pacific is expected to registered the highest CAGR the global advanced packaging materials for semiconductors market owing to due to its status as a major semiconductor manufacturing hub. Countries like Taiwan and South Korea are key players in semiconductor production, driving demand for advanced packaging materials. For instance, Taiwan's TSMC is a leading semiconductor manufacturer that heavily relies on advanced packaging techniques. The region's strategic importance in the semiconductor industry, coupled with ongoing technological advancements, positions APAC for significant growth in the advanced packaging materials market for semiconductors.

Some of the major players in the global advanced packaging materials for semiconductors market include ASE Group, Amkor Technology, Taiwan Semiconductor Manufacturing Company (TSMC), DowDupont, Jcet/Stats Chippac Ltd, Siliconware Precision Industries Co. Ltd (Spil), Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd, Fujitsu Semiconductor Ltd, UTAC Group, Chipmos Technologies Inc., Chipbond Technology Corporation, Intel Corporation, Samsung Electronics Co. Ltd, Unisem (M) Berhad, and Interconnect Systems Inc. (ISI).

Global Advanced Packaging Materials for Semiconductors Market Coverage (By Value)

• Material Type Insight and Forecast 2018-2030

• Silicones

• Copper

• Low-k Dielectric

• Mold Compounds

• BT Resin (Bismaleimide Triazine)

• Glass Interposers

• Solder Materials

• Packaging Platform Insight and Forecast 2018-2030

• Flip Chip

• Embedded Die

• Fan-in Wafer Level Packaging

• Fan-out Wafer Level Packaging (FOWLP)

• End-User Insight and Forecast 2018-2030

• Automotive Industry

• Electrical and Electronics Industry

• Power and Energy Industry

• Other End-use Industry

Geographical Segmentation

Global Advanced Packaging Materials for Semiconductors Market by Region

• North America

• By Material Type

• By Packaging Platform

• By End-user

• By Country – U.S., Canada, and Mexico

• Europe

• By Material Type

• By Packaging Platform

• By End-user

• By Country – Germany, U.K., France, Italy, Spain, Russia, and Rest of Europe

• Asia-Pacific (APAC)

• By Material Type

• By Packaging Platform

• By End-user

• By Country – China, Japan, India, South Korea, and Rest of Asia-Pacific

• South America

• By Material Type

• By Packaging Platform

• By End-user

• By Country – Argentina, Brazil, Chile, and Rest of South America

• Middle East and Africa

• By Material Type

• By Packaging Platform

• By End-user

• By Country – Saudi Arabia, South Africa, U.A.E, and Rest of Middle East and Africa