Advanced Packaging Materials for Semiconductors Market

2025

2030

Advanced Packaging Materials for Semiconductors Market – Analysis and Forecast (2025-2030)

Industry Insight by Material Type (silicones, copper, low-k dielectric, mold compounds, BT Resin (Bismaleimide Triazine), glass interposers, and solder Materials), by Packaging Platform (Flip Chip, Embedded Die, Fan-in Wafer Level Packaging, and Fan-out Wafer Level Packaging (FOWLP)), by End-User (automobile, electrical and electronics, power and energy, and other industries), and Geography (U.S., Canada, Germany, U.K., France, China, Japan, India, and Rest of the World)

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Industry Overview

Advanced Packaging Materials for Semiconductors are a range of specialized substances used in assembling and protecting semiconductor components. These materials are designed to fulfill demanding performance standards. Preferred for their insulating qualities and thermal stability, silicones help with efficient heat management, while high conductivity copper is preferred for interconnects, low-k dielectrics for minimized signal distortion. In fan-out wafer-level packaging (FOWLP), mold compounds provide mechanical durability. Ingenious materials like glass interposers allow 3D stacking for more integration, while organic substrates like BT resin improve interconnect density.

Global Advanced Packaging Materials for Semiconductors market was worth USD 34.29 billion in 2023 and is expected reach USD 59.00 billion by 2030 with a CAGR of 7.02% during the forecast period, i.e., 2025-2030. The growing demand for advanced packaging materials is driven by the rising semiconductor complexity, demand for miniaturization, and higher processing speeds. Additionally, thermal management, power efficiency, and 3D integration capabilities are driving the demand for specialized packaging solutions for semiconductors.

Advanced Packaging Materials for Semiconductors Market

Geographically, the market is expanding rapidly in North America, Europe, and the Asia Pacific, as a result of the presence of large companies such as Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, and Advanced Semiconductor Engineering, Inc. (ASE Group), huge investment in the R&D, and growing demand for EVs; however, the market confronts constraints such as investment requirement and adverse economic environment. Overall, the Advanced Packaging Materials for Semiconductors market offers potential prospects for market participants to develop and fulfill the growing needs of wide range of industries including automobile, electrical and electronics, power and energy, and other industries.

Market Segmentation

Insight by Material Type

Based on the material type, the global Advanced Packaging Materials for Semiconductors market is segmented into silicones, copper, low-k dielectric, mold compounds, BT Resin (Bismaleimide Triazine), glass interposers, and solder Materials. Copper dominated the global Advanced Packaging Materials for Semiconductors market with ~40% share in 2023 due to its excellent electrical conductivity, which is essential for effective data transfer inside chips. Its high thermal conductivity also aids in effective heat dissipation, vital for maintaining optimal operating temperatures in high-performance devices. Copper is a seamless option for interconnects due to its compatibility with semiconductor fabrication methods. Its affordability and plentiful availability also contribute to its dominant share in the market. Furthermore, Copper's dominant position in the semiconductor packaging business is cemented by the growing need for faster and more powerful chips resulting from advancements in semiconductor technologies.

Insight by Packaging Platform

Based on the packaging platform, the global Advanced Packaging Materials for Semiconductors market is segmented into Flip Chip, Embedded Die, Fan-in Wafer Level Packaging, and Fan-out Wafer Level Packaging (FOWLP). In 2023, FOWLP dominated the global Advanced Packaging Materials for Semiconductors market as it allows several dies to be stacked and coupled on a single substrate, providing improved integration capabilities. Its superior electrical performance, small size, and ability to dissipate heat make it appropriate for a variety of uses, from high-performance computing to mobile electronics. Furthermore, FOWLP allows for a smaller form factor and enhances signal integrity, which makes it a flexible option for contemporary semiconductor packaging requirements. This adaptable platform's outstanding performance and efficiency advantages have helped it gain the dominant share in the Advanced Packaging Materials for Semiconductors market.

Insight by End-User

Based on the end-use industry, the global Advanced Packaging Materials for Semiconductors market is segmented into automobile, electrical and electronics, power and energy, and other industries. The electrical and electronics industry dominated the market in 2023 owing to its wide range of applications. Modern electronics are built on semiconductors, which are used to power everything from industrial machines to cellphones and advanced packaging materials are becoming more and more necessary as customer demands for quicker, smaller, and more energy-efficient electronics rise. The industry's growing demand for high-performance semiconductors fuels ongoing packaging material innovation. Furthermore, the electrical and electronics industry's dominance in the global Advanced Packaging Materials for Semiconductors market is cemented by the strict quality and reliability standards in industries like aerospace and healthcare, which demand state-of-the-art packaging materials to protect delicate electronic components.

Global Advanced Packaging Materials for Semiconductors Market Report Coverage

Report Metric	Details
Historical Period	2018 - 2023
Base Year Considered	2024
Forecast Period	2025 - 2030
Market Size in 2023	U.S.D. 34.29 Billion
Revenue Forecast in 2030	U.S.D. 59.00 Billion
Growth Rate	7.02%
Segments Covered in the Report	By Material Type, By Packaging Platform, and By End-User
Report Scope	Market Trends, Drivers, and Restraints; Revenue Estimation and Forecast; Segmentation Analysis; Impact of COVID-19; Companies’ Strategic Developments; Market Share Analysis of Key Players; Company Profiling
Regions Covered in the Report	North America, Europe, Asia-Pacific, Middle East, and Rest of the World

Industry Dynamics

Growth Drivers

Growing demand for electric vehicles

One of the main factors propelling the advanced packaging materials for semiconductors market is the rising demand for electric vehicles (EVs). EVs' sophisticated control systems, power management, and battery technologies rely heavily on semiconductor components. Silicones, highly valued for their superior thermal conductivity, are essential for effectively dispersing the heat produced by the powerful electric drivetrains. Because of its high conductivity, copper is used for interconnects in the EVs, which guarantees effective signal transmission in the control systems of the car. In order to maximize the performance of EVs, low-k dielectrics are essential for cutting down on energy consumption and signal delays.

The EV's engine and control systems' delicate electronic components are mechanically protected by mold compounds while organic substrates employ BT Resin (Bismaleimide Triazine), which increases interconnect density and permits compact designs. Furthermore, solder materials are essential for connecting and bonding different semiconductor components in electric vehicles (EVs), resulting in strong and dependable electrical connections. The development of the semiconductor packaging business is fueled by the combined effects of these advanced packaging materials, which help semiconductor devices in electric vehicles operate dependably and efficiently.

Emergence of Internet of Things (IoT)

The Internet of Things' (IoT) rapid proliferation is a major growth driver for the advanced packaging materials for semiconductors market. Compact, high-performance semiconductor packages are becoming more and more in demand as a result of the widespread use of sensors and linked devices across numerous industries. Specialized packaging materials that combine reliability, miniaturization potential, and thermal stability are needed for IoT applications.

Key players in semiconductor manufacturing and packaging services, such as ASE Group and Amkor Technology, are at the forefront of satisfying this need. Amkor Technology is a top supplier of test and packaging services for semiconductors. They make significant investments in R&D to provide cutting-edge packaging solutions made specifically for Internet of Things devices. Additionally, major semiconductor foundries like Taiwan Semiconductor Manufacturing Company (TSMC) are also actively involved in developing cutting-edge packaging technologies to support the burgeoning IoT market. These companies are driving innovation in advanced packaging materials to meet the unique requirements of IoT applications, thereby fueling the growth of the advanced packaging materials for semiconductors market.

Challenge

Lack of options for advanced packaging materials

The growing need for materials that can withstand the harsh operating conditions is one of the main obstacles for the growth of the advanced packaging materials for semiconductors market. Semiconductor devices produce more heat as they get smaller and more powerful and packaging materials that may efficiently disperse heat without sacrificing structural integrity are in high demand. One of the biggest challenges faced by the businesses is finding the materials that properly balance electrical insulation, mechanical toughness, and thermal conductivity. The production of such sophisticated packaging materials is major roadblock in the advancement of semiconductor technology.

Geographic Overview

North America
Europe
Asia Pacific (APAC)
Middle East and Africa (MEA)
South America

The global Advanced Packaging Materials for Semiconductors market is segmented into North America, Europe, the Asia-Pacific, Latin America, and the Middle East and Africa region. The global Advanced Packaging Materials for Semiconductors market is dominated by the Asia-Pacific region due to the convergence of several important elements. Notably, it is home to epicenters for semiconductor production, such as South Korea, China, and Taiwan, all of which have highly developed manufacturing capacities. The headquarters of prominent players including Samsung Electronics, Amkor Technology, and ASE Group propel innovation in packaging technology.

Additionally, the market's expansion is supported by strategic alliances between local businesses and international material suppliers, such as ASE's alliance with Henkel. Key roles are played by government programs that support R&D and infrastructure expenditures in semiconductor businesses, such as Taiwan's "Asian Silicon Valley" project. Asia-Pacific is a pioneer in innovative semiconductor packaging materials owing to its strong ecosystem, which combines technological know-how, strategic alliances, and supportive regulations.

Competitive Insight

One of the leading companies in the advanced packaging materials for semiconductors market is Taiwan Semiconductor Manufacturing Company (TSMC). TSMC is well-known for its foundry services, but it also has a significant presence in packaging technology. Their cutting-edge InFO (Integrated Fan-Out) packaging technology makes it possible to create small, powerful chips. TSMC's dedication to innovation is demonstrated by its partnerships with sophisticated packaging companies such as ASE (sophisticated Semiconductor Engineering) and material suppliers like Dow. TSMC is at the forefront of semiconductor developments, setting industry standards for performance, miniaturization, and power efficiency through strategic partnerships and state-of-the-art packaging processes.

ASE Group holds a prominent position within the advanced packaging materials for semiconductors market. ASE has alliances with top producer of electronics components, such as TDK Corporation, and works closely with material suppliers like Henkel. Industry recognition has been awarded to ASE for its vast knowledge of flip-chip packaging and System-in-Package (SiP) solutions. Furthermore, Universal Scientific Industrial (USI), a subsidiary of ASE Group, expands the group's system integration capabilities. ASE remains a powerful force in the semiconductor packaging industry due to its solid relationships across the supply chain and a wide range of packaging techniques.

Recent Development by Key Players

In September 2023, Samsung announced that it is automating its semiconductor packaging with initial results showing doubled efficiency. Samsung has become the first company in the world to launch a labor-free semiconductor packaging line with a goal of converting its packaging plants to be human labor-free by 2030.

In September 2023, the Electronics and Telecommunications Research Institute (ETRI) in South Korea developed a revolutionary 95% power-saving semiconductor packaging technology, marking the first time such an advancement has been accomplished. The new process has streamlined the semiconductor chiplet packaging process from a complex nine-step procedure to just three simple steps.

Key Players Covered in the Report

ASE Group, Amkor Technology, Taiwan Semiconductor Manufacturing Company (TSMC), DowDupont, Jcet/Stats Chippac Ltd, Siliconware Precision Industries Co. Ltd (Spil), Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd, Fujitsu Semiconductor Ltd, UTAC Group, Chipmos Technologies Inc., Chipbond Technology Corporation, Intel Corporation, Samsung Electronics Co. Ltd, Unisem (M) Berhad, and Interconnect Systems Inc. (ISI).

The Advanced Packaging Materials for Semiconductors market report offers a comprehensive market segmentation analysis along with an estimation for the forecast period 2025–2030.

Segments Covered in the Report

By Material Type

Silicones
Copper
Low-k Dielectric
Mold Compounds
BT Resin (Bismaleimide Triazine)
Glass Interposers
Solder Materials

By Packaging Platform

Flip Chip
Embedded Die
Fan-in Wafer Level Packaging
Fan-out Wafer Level Packaging (FOWLP)

By End-Use Industry

Automotive Industry
Electrical and Electronics Industry
Power and Energy Industry
Other End-use Industry

Region Covered in the Report

North America

U.S.
Canada
Mexico

Europe

Germany
U.K.
France
Italy
Spain
Russia
Rest of Europe

Asia-Pacific (APAC)

China
Japan
India
South Korea
Rest of Asia-Pacific

Middle East and Africa (MEA)

Saudi Arabia
U.A.E
South Africa
Rest of MEA

South America

Argentina
Brazil
Chile
Rest of Latin America

Primary Research Interviews Breakdown

France Skincare Devices Market Size

1. Research Overview

1.1. The Report Offers
1.2. Market Coverage
1.2.1. By Material Type
1.2.2. By Packaging Platform
1.2.3. By End-User
1.2.4. By Region
1.3. Research Phases
1.4. Limitations
1.5. Market Methodology
1.5.1. Data Sources
1.5.1.1. Primary Research
1.5.1.2. Secondary Research
1.5.2. Methodology
1.5.2.1. Data Exploration
1.5.2.2. Forecast Parameters
1.5.2.3. Data Validation
1.5.2.4. Assumptions
1.5.3. Study Period & Data Reporting Unit

2. Executive Summary

3. Industry Overview

3.1. Industry Dynamics
3.1.1. Market Growth Drivers
3.1.2. Market Restraints
3.1.3. Key Market Trends
3.1.4. Major Opportunities
3.2. Industry Ecosystem
3.2.1. Porter’s Five Forces Analysis
3.2.2. Recent Development Analysis
3.2.3. Value Chain Analysis
3.3. Competitive Insight
3.3.1. Competitive Position of Industry Players
3.3.2. Market Attractive Analysis
3.3.3. Market Share Analysis

4. Global Market Estimate and Forecast

4.1. Global Market Overview
4.2. Global Market Estimate and Forecast to 2030

5. Market Segmentation Estimate and Forecast

5.1. By Material Type
5.1.1. Silicones
5.1.1.1. Market Definition
5.1.1.2. Market Estimation and Forecast to 2030
5.1.2. Copper
5.1.2.1. Market Definition
5.1.2.2. Market Estimation and Forecast to 2030
5.1.3. Low-k dielectric
5.1.3.1. Market Definition
5.1.3.2. Market Estimation and Forecast to 2030
5.1.4. Mold Compounds
5.1.4.1. Market Definition
5.1.4.2. Market Estimation and Forecast to 2030
5.1.5. BT Resin (Bismaleimide Triazine)
5.1.5.1. Market Definition
5.1.5.2. Market Estimation and Forecast to 2030
5.1.6. Glass interposer
5.1.6.1. Market Definition
5.1.6.2. Market Estimation and Forecast to 2030
5.1.7. Solder Materials
5.1.7.1. Market Definition
5.1.7.2. Market Estimation and Forecast to 2030
5.2  By Packaging Platform
5.2.1. Flip Chip
5.2.1.1. Market Definition
5.2.1.2. Market Estimation and Forecast to 2030
5.2.2. Embedded Die
5.2.2.1. Market Definition
5.2.2.2. Market Estimation and Forecast to 2030
5.2.3.  Fan-in Wafer Level Packaging
5.3.3.1. Market Definition
5.3.3.2. Market Estimation and Forecast to 2030
5.2.4. Fan-out Wafer Level Packaging (FOWLP)
5.2.4.1. Market Definition
5.2.4.2. Market Estimation and Forecast to 2030
5.3.  By End-User
5.3.1.  Automobile
5.3.1.1. Market Definition
5.3.1.2. Market Estimation and Forecast to 2030
5.3.2.  Electrical and electronics
5.3.2.1. Market Definition
5.3.2.2. Market Estimation and Forecast to 2030
5.3.3.  Power and Energy
5.3.3.1. Market Definition
5.3.3.2. Market Estimation and Forecast to 2030
5.3.4.  Other Industries
5.3.4.1. Market Definition
5.3.4.2. Market Estimation and Forecast to 2030
6. North America Market Estimate and Forecast

6.1. By Material Type
6.2. By Packaging Platform
6.3. By End-User
6.4.1. U.S. Market Estimate and Forecast
6.4.2. Canada Market Estimate and Forecast
6.4.3. Mexico Market Estimate and Forecast

7. Europe Market Estimate and Forecast

7.1. By Material Type
7.2. By Packaging Platform
7.3. By End-User
7.4.1. Germany Market Estimate and Forecast
7.4.2. France Market Estimate and Forecast
7.4.3. U.K. Market Estimate and Forecast
7.4.4. Italy Market Estimate and Forecast
7.4.5. Spain Market Estimate and Forecast
7.4.6. Rest of Europe Market Estimate and Forecast

8. Asia-Pacific Market Estimate and Forecast

8.1. By Material Type
8.2. By Packaging Platform
8.3. By End-User
8.4. By Country – China, Japan, India, South Korea, and Rest of Asia-Pacific
8.4.1. China Market Estimate and Forecast
8.4.2. Japan Market Estimate and Forecast
8.4.3. India Market Estimate and Forecast
8.4.4. South Korea Market Estimate and Forecast
8.4.5. Singapore Market Estimate and Forecast
8.4.6. Rest of Asia-Pacific Market Estimate and Forecast

9. Rest of the World (RoW) Market Estimate and Forecast

9.1. By Material Type
9.2. By Packaging Platform
9.3. By End-User
9.4. By Country – Brazil, Saudi Arabia, South Africa, U.A.E., and Other Countries
9.4.1. Brazil Market Estimate and Forecast
9.4.2. Saudi Arabia Market Estimate and Forecast
9.4.3. South Africa Market Estimate and Forecast
9.4.4. Other Countries Market Estimate and Forecast

10. Company Profiles

10.1. ASE Group
10.1.1. Snapshot
10.1.2. Overview
10.1.3. Offerings
10.1.4. Financial Insight
10.1.5. Recent Developments
10.2. Amkor Technology
10.2.1. Snapshot
10.2.2. Overview
10.2.3. Offerings
10.2.4. Financial Insight
10.2.5. Recent Developments
10.3. Taiwan Semiconductor Manufacturing Company (TSMC)
10.3.1. Snapshot
10.3.2. Overview
10.3.3. Offerings
10.3.4. Financial Insight
10.3.5. Recent Developments
10.4. DowDupont
10.4.1. Snapshot
10.4.2. Overview
10.4.3. Offerings
10.4.4. Financial Insight
10.4.5. Recent Developments
10.5. Jcet / Stats Chippac Ltd
10.5.1. Snapshot
10.5.2. Overview
10.5.3. Offerings
10.5.4. Financial Insight
10.5.5. Recent Developments
10.6. Siliconware Precision Industries Co. Ltd (Spil)
10.6.1. Snapshot
10.6.2. Overview
10.6.3. Offerings
10.6.4. Financial Insight
10.6.5. Recent Developments
10.7. Powertech Technology Inc.
10.7.1. Snapshot
10.7.2. Overview
10.7.3. Offerings
10.7.4. Financial Insight
10.7.5. Recent Developments
10.8. Tianshui Huatian Technology Co. Ltd
10.8.1. Snapshot
10.8.2. Overview
10.8.3. Offerings
10.8.4. Financial Insight
10.8.5. Recent Developments
10.9. Fujitsu Semiconductor Ltd
10.9.1. Snapshot
10.9.2. Overview
10.9.3. Offerings
10.9.4. Financial Insight
10.9.5. Recent Developments
10.10. UTAC Group
10.10.1. Snapshot
10.10.2. Overview
10.10.3. Offerings
10.10.4. Financial Insight
10.10.5. Recent Developments
10.11. Chipmos Technologies Inc.
10.11.1. Snapshot
10.11.2. Overview
10.11.3. Offerings
  10.11.4. Financial Insight
  10.11.5. Recent Developments
10.12.  Chipbond Technology Corporation
10.12.1. Snapshot
10.12.2. Overview
10.12.3. Offerings
10.12.4. Financial Insight
10.12.5. Recent Developments
10.13. Intel Corporation
10.13.1. Snapshot
10.13.2. Overview
10.13.3. Offerings
10.13.4. Financial Insight
10.13.5. Recent Developments
10.14. Samsung Electronics Co. Ltd
10.14.1. Snapshot
10.14.2. Overview
10.14.3. Offerings
10.14.4. Financial Insight
10.14.5. Recent Developments
10.15.  Unisem (M) Berhad
10.15.1. Snapshot
10.15.2. Overview
10.15.3. Offerings
10.15.4. Financial Insight
10.15.5. Recent Developments
10.16.  Interconnect Systems Inc. (ISI)
10.16.1. Snapshot
10.16.2. Overview
10.16.3. Offerings
10.16.4. Financial Insight
10.16.5. Recent Development
11. Appendix

11.1. Exchange Rates
11.2. Abbreviations

Note: Financial insight and recent developments of different companies are subject to the availability of information in the secondary domain.

List of Tables

Table 1 Materials
Table 2 Study Periods
Table 3 Data Reporting Unit
Table 4 Global Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2023 (USD Billion)
Table 5 Global Advanced Packaging Materials for Semiconductors Market Size, by Material, 2025 - 2030 (USD Billion)
Table 6 Global Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2018 - 2023 (USD Billion)
Table 7 Global Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2025 - 2030 (USD Billion)
Table 8 Global Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2018 - 2023 (USD Billion)
Table 8 Global Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2025 - 2030 (USD Billion)
Table 10 Global Advanced Packaging Materials for Semiconductors Market Size, by Region, 2018 - 2023 (USD Billion)
Table 11 Global Advanced Packaging Materials for Semiconductors Market Size, by Region, 2025 - 2030 (USD Billion)
Table 12 North America Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2023 (USD Billion)
Table 13 North America Advanced Packaging Materials for Semiconductors Market Size, by Material, 2025 - 2030 (USD Billion)
Table 14 North America Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2018 - 2023 (USD Billion)
Table 15 North America Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2025 - 2030 (USD Billion)
Table 16 North America Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2018 - 2023 (USD Billion)
Table 17 North America Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2025 - 2030 (USD Billion)
Table 18 North America Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2023 (USD Billion)
Table 19 North America Advanced Packaging Materials for Semiconductors Market Size, by Country, 2025 - 2030 (USD Billion)
Table 20 Europe Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2023 (USD Billion)
Table 21 Europe Advanced Packaging Materials for Semiconductors Market Size, by Material, 2025 - 2030 (USD Billion)
Table 22 Europe Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2018 - 2023 (USD Billion)
Table 23 Europe Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2025 - 2030 (USD Billion)
Table 24 Europe Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2018 - 2023 (USD Billion)
Table 25 Europe Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2025 - 2030 (USD Billion)
Table 26 Europe Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2023 (USD Billion)
Table 27 Europe Advanced Packaging Materials for Semiconductors Market Size, by Country, 2025 - 2030 (USD Billion)
Table 28 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2023 (USD Billion)
Table 29 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Material, 2025 - 2030 (USD Billion)
Table 30 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2018–22 (USD Billion)
Table 31 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2023–30 (USD Billion)
Table 32 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by End-User 2018 - 2023 (USD Billion)
Table 33 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2025 - 2030 (USD Billion)
Table 34 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2023 (USD Billion)
Table 35 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Country, 2025 - 2030 (USD Billion)
Table 36 RoW Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2023 (USD Billion)
Table 37 RoW Advanced Packaging Materials for Semiconductors Market Size, by Material, 2025 - 2030 (USD Billion)
Table 38 RoW Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2018 - 2023 (USD Billion)
Table 39 RoW Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform, 2025 - 2030 (USD Billion)
Table 40 RoW Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2018 - 2023 (USD Billion)
Table 41 RoW Advanced Packaging Materials for Semiconductors Market Size, by End-User, 2025 - 2030 (USD Billion)
Table 42 RoW Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2023 (USD Billion)
Table 43 RoW Advanced Packaging Materials for Semiconductors Market Size, by Country, 2025 - 2030 (USD Billion)
Table 44 Snapshot – ASE Group
Table 45 Snapshot – Amkor Technology
Table 46 Snapshot – Taiwan Semiconductor Manufacturing Company (TSMC)
Table 47 Snapshot – DowDupont
Table 48 Snapshot – Jcet / Stats Chippac Ltd
Table 49 Snapshot – Siliconware Precision Industries Co. Ltd (Spil)
Table 50 Snapshot – Powertech Technology Inc.
Table 51 Snapshot – Tianshui Huatian Technology Co. Ltd
Table 52 Snapshot – Fujitsu Semiconductor Ltd
Table 53 Snapshot – UTAC Group
Table 54 Snapshot – Chipmos Technologies Inc.
Table 55 Snapshot – Chipbond Technology Corporation
Table 56 Snapshot – Intel Corporation
Table 57 Snapshot – Samsung Electronics Co. Ltd
Table 58 Snapshot – Unisem (M) Berhad
Table 59 Snapshot – Interconnect Systems Inc. (ISI)

List of Figures

Figure 1 Market Coverage
Figure 2 Research Phases
Figure 3 Secondary Materials for Different Parameters
Figure 4 Methodology
Figure 5 Data Mining & Exploration
Figure 6 Data Triangulation
Figure 7 Assumptions for Market Estimation and Forecast
Figure 8 Market Synopsis
Figure 9 Global Advanced Packaging Materials for Semiconductors Market - Growth Drivers and Restraints
Figure 10 Competitive Benchmark
Figure 11 Global Advanced Packaging Materials for Semiconductors Market Highlight
Figure 12 Global Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2030 (USD Billion)
Figure 13 Global Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform 2018 - 2030 (USD Billion)
Figure 14 Global Advanced Packaging Materials for Semiconductors Market Size, by End-User 2018 - 2030 (USD Billion)
Figure 15 Global Advanced Packaging Materials for Semiconductors Market Size, by Region, 2018 - 2030 (USD Billion)
Figure 16 North America Advanced Packaging Materials for Semiconductors Market Highlight
Figure 17 North America Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2030 (USD Billion)
Figure 18 North America Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform 2018 - 2030 (USD Billion)
Figure 19 North America Advanced Packaging Materials for Semiconductors Market Size, by End-User 2018 - 2030 (USD Billion)
Figure 20 North America Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2030 (USD Billion)
Figure 21 Europe Advanced Packaging Materials for Semiconductors Market Highlight
Figure 22 Europe Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2030 (USD Billion)
Figure 23 Europe Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform 2018 - 2030 (USD Billion)
Figure 24 Europe Advanced Packaging Materials for Semiconductors Market Size, by End-User 2018 - 2030 (USD Billion)
Figure 25 Europe Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2030 (USD Billion)
Figure 26 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Highlight
Figure 27 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2030 (USD Billion)
Figure 28 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform 2018 - 2030 (USD Billion)
Figure 29 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by End-User 2018 - 2030 (USD Billion)
Figure 30 Asia-Pacific Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2030 (USD Billion)
Figure 31 RoW Advanced Packaging Materials for Semiconductors Market Highlight
Figure 32 RoW Advanced Packaging Materials for Semiconductors Market Size, by Material, 2018 - 2030 (USD Billion)
Figure 33 RoW Advanced Packaging Materials for Semiconductors Market Size, by Packaging Platform 2018 - 2030 (USD Billion)
Figure 34 RoW Advanced Packaging Materials for Semiconductors Market Size, by End-User 2018 - 2030 (USD Billion)
Figure 35 RoW Advanced Packaging Materials for Semiconductors Market Size, by Country, 2018 - 2030 (USD Billion)

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