Global Radiation-Hardened Electronics Market – Analysis and Forecast (2023-2030)  Industry Insight by Product Type (Custom-Made and Commercial-off-the-Shelf), by Material Type (Silicon, Hydrogenated Amorphous Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, and Others), by Component (Memory, Logic, Power Management, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog & Digital Mix Signals, and Controllers & Processors), by Manufacturing Techniques (Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS)), by Application (Space, Aerospace & Defense, Nuclear Power Plants, Commercial Satellites, Medical, and Others), and Geography (U.S., Canada, Germany, U.K., France, China, Japan, India, and Rest of the World)
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