Status : Published Published On : Mar, 2022 Report Code : VRSME9106 Industry : Semiconductor & Electronics Available Format : Page : 300
2022
2028

Global Radiation-Hardened Electronics Market – Analysis and Forecast (2021-2027)
Industry Insight by Product Type (Custom-Made and Commercial-off-the-Shelf), by Material Type (Silicon, Hydrogenated Amorphous Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, and Others), by Component (Memory, Logic, Power Management, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog & Digital Mix Signals, and Controllers & Processors), by Manufacturing Techniques (Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS)), by Application (Space, Aerospace & Defense, Nuclear Power Plants, Commercial Satellites, Medical, and Others), and Geography (U.S., Canada, Germany, U.K., France, China, Japan, India, and Rest of the World)

Industry Overview

From USD 1.7 billion in 2021, the global radiation-hardened electronics market is anticipated to grow to USD 2.1 billion by 2027, registering a CAGR of 3.6% during the forecast period 2021-2027. The term "radiation-hardened electronics" refers to a group of electronic components, packages, and devices designed specifically for operation in high-altitude environments. Silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon are among the materials utilized to make such components. High-energy radiations, as well as ionizing, gamma, and neutron radiation produced by nuclear reactors, do not harm these components. Radiation hardened products are subjected to one or more resultant effects tests, such as total ionizing dose (TID), enhanced low dose rate effects (ELDRS), neutron and proton displacement damage, and single event effects (SET, SEL, SEE, and SEB). Switching regulators, microprocessors, and power supply devices are frequently used in satellites, aircraft, and nuclear power plants. As a result, they have a wide range of applications in a variety of industries, including aviation, space, military, and defense.

Radiation-Hardened Electronics Market Highlights

The COVID-19 outbreak has led to risks and uncertainties globally and the radiation-hardened electronics market has also been impacted by it.  High import taxes resulting from trade tensions between China and the United States had a significant impact on radiation-hardened component imports in the United States. Additionally, supply chain disruptions harmed US-based market leaders and produced supply-demand mismatches. and also an unplanned halt in production plants had a significant impact on overall market growth.

Market Segmentation

Insight by Product Type

Based on product type, the global radiation-hardened electronics market is bifurcated into custom-made and commercial-off-the-shelf (COTS). The commercial off-the-shelf is anticipated to have a faster growth due to the high bandwidth that is required in satellite applications and enhanced performance.

Insight by Material Type

Based on material type, the global radiation-hardened electronics market is segmented into silicon, hydrogenated amorphous silicon, silicon carbide, gallium nitride, gallium arsenide, and others. Silicon is anticipated to have significant growth during 2021-2027. Electronic components composed of silicon are selected for innovative solutions and assist both strategic and space missions, resulting in significant market growth. Manufacturers' increased interest in developing crucial microelectronic equipment, such as microprocessors, that are more reliable in hostile environments, such as space and military field deployments, resulting in the growth of the segment.

Insight by Component

Based on component, the global radiation-hardened electronics market is segmented into Memory, Logic, Power Management, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog & Digital Mix Signals, and Controllers & Processors. Power management is anticipated to have a constant growth during 2021-2027 owing to increased demand for metal-oxide-semiconductor field-effect transistor (MOSFETs) also called metal-oxide-silicon transistor (MOSTs) and diodes for various high-end applications in space, aerospace, and defense industries, resulting in the growth of the segment in the radiation-hardened electronics market. Furthermore, the power MOSFETs are employed in high-reliability requirements and developed for outer space requirements because they have good durability against high-energy charged particles and ionizing radiation.

Insight by Manufacturing Techniques

Based on manufacturing techniques, the global radiation-hardened electronics market is classified into Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS). The RHBD is anticipated to grow significantly owing to ease in modification, reduction in cost per ship, and large-scale production. RHBD memory, microcontrollers, and ASICs are largely employed in nuclear power facilities, as well as the defense and space industries. Because RHBD enables easy adjustments by various government programs based on the intended applications, the market for RHBD designs is boosted during COVID-19.

Insight by Application

Based on application, the global radiation-hardened electronics market is classified into space, aerospace & defense, nuclear power plants, commercial satellites, medical, and others. Space is anticipated to grow at a higher pace during 2021-2027 owing to the increased adoption of radiation-hardened components in telephone satellites, TV broadcasting, several types of satellites, and rising demand for earth observation satellites for weather updates and research. Additionally, the increasing number of space missions worldwide will drive the development of radiation-hardened electronics market.

Radiation-Hardened Electronics Market Report Coverage

Report Metric

Details

Historical Period

2015–2020

Base Year Considered

2021

Forecast Period

2021-2027

Market Size in 2021

$1.7 Billion

Revenue Forecast in 2027

$2.1 Billion

Growth Rate

CAGR 3.6%

Segments Covered in the Report

By Product Type, By Material Type, By Component, By Manufacturing Techniques, and By Application

Report Scope

Market Trends, Drivers, and Restraints; Revenue Estimation and Forecast; Segmentation Analysis; Impact of COVID-19; Companies’ Strategic Developments; Market Share Analysis of Key Players; Company Profiling

Regions Covered in the Report

North America, Europe, Asia-Pacific, Middle East, and Rest of the World

 

Industry Dynamics

Industry Trends

With the mounting growth in internet accessibility globally, technological development like 5G, blockchain, cloud services, IoT, and AI has led to economic growth. Furthermore, development in the ICT sector led to growth in GDP, labor productivity, and increased R&D expenditure globally. These are the trends prevalent in the market that will lead to the growth of the global radiation-hardened electronics market.

Growth Drivers

The increasing intelligence, surveillance, and reconnaissance (ISR) operations globally, robust development in field-programming gate arrays (FPGAs), and multicore processor technologies for military and space applications will accelerate the growth of the radiation-hardened electronics market. Moreover, the increased demand for radiation-hardened electronics in communication satellites and high demand for electronic systems that can tolerate radiation exposure in the nuclear power industry, rising number of space missions, and technological development will augment the growth of the radiation-hardened electronics market. The rising number of space mission and exploratory activities, extensive product adoption for manufacturing power management devices, the establishment of autonomous military operations in hostile environments, rising demand for radiation-hardened electronics in nuclear and healthcare, rising demand for diodes, transistors, and MOSFETs in various defense and space applications, and technological development like the growth of highly reliable integrated circuits and enhancements in the field-programmable gate array (FPGA) technology will propel the growth of the radiation-hardened electronics market.

Challenges

Radiation hardened electronics growth may be hampered by problems in constructing actual testing conditions, personalized requirements of high-end consumers, as well as costly research and design expenditures. Furthermore, the development of small satellites having smaller life cycles may hinder the growth of the market.

Opportunities

The increasing R&D activities, the surge in need for reconfigurable radiation-hardened components, and increased adoption of commercial-off-the-shelf products in satellites and other space applications will create novel opportunities for the development of the radiation-hardened electronics market.

Geographic Overview

North America contributes to the largest market share in the radiation-hardened electronics market owing to the presence of major industry players and prominent space and defense institutes in the region that will propel the growth of the radiation-hardened components.

Because of the use of technologically improved target products for various space-related equipment, Europe's radiation-hardened electronics industry contributes the second-largest share in the global market.

Competitive Insight

The electronics manufacturing sector is very competitive, and as the global environment changes and applications diversify, companies must adapt their product portfolios to meet the changing needs of end consumers. There in a need to upgrade contracts so as to improve the capabilities of the current fleet of operational military assets, resulting in the growth of the market. Players are heavily spending in R&D of complex product offerings in order to secure long-term contracts and increase market share. Furthermore, the active participants in the radiation-hardened electronics market have been promoting technological innovations in platforms, associated products, and solutions through constant R&D.

For more than 50 years, BAE Systems' sophisticated, radiation-hardened electronic components, cards, processors, and modules have enabled civil, commercial, and national security space operations. Rad-hard, space-qualified electronics products include radiation-hardened Single Board Computers (SBCs) (RAD5545® SpaceVPX Multi-Core Single Board Computer and RAD750® SBC), Rad-hard Standard Components (SRAM, C-RAM, PROM, and FPGAs), Rad-hard Application-Specific Integrated Circuits (ASICs).

To avoid radiation damage in space and aerospace applications, radiation-hardened microchips in electronic devices are required. Infineon HIRel offers an extensive range of radiation-hardened semiconductors.  The Infineon rad-hard MOSFET power transistors are the global benchmark in radiation hardness and electrical performance, thanks to the unique CoolMOSTM superjunction technology.  Infineon supplies best-in-class radiation-hard powerMOS transistors for all kinds of space applications, with extremely low specific RDS(ON) and a comfortable Safe Operating Area (SOA) regarding SEE.

In January 2022, BAE Systems has been awarded a $60 million contract by Army Contracting Command-Rock Island to create next-generation, radiation-hardened by design microelectronics. The contract's efforts could lead to better access to more advanced process nodes for the US defense and aerospace communities in the future. The program's principal purpose is to provide the US government and aerospace sector with onshore access to cutting-edge microelectronics technology.

In June 2021, Microchip Technology Inc. has certified its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on) metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial and defense space applications. In power conversion circuits such as point-of-load converters, DC-DC converters, motor drives, and controllers, and general-purpose switching, Microchip's radiation-hardened M6 MRH25N12U3 MOSFET serves as the principal switching element. The MOSFET can endure the harsh environments of space, improve power circuitry dependability, and meet all MIL-PRF19500/746 criteria with improved performance.

Some of the major players operating in the radiation-hardened electronics market include Microchip Technology Inc., BAE Systems, Infineon Technologies AG, STMicroelectronics, Renesas Electronics Corporation, Honeywell International Inc., Advanced Micro Devices, Inc (Previously known as Xilinx Incorporation), Texas Instruments Incorporated, Analog Devices, Inc., and Teledyne Technologies Inc.

Radiation-Hardened Electronics Market Size and Market Analysis

Region Covered in the Report

•    North America

- U.S.
- Canada
- Mexico

•    Europe

- Germany
- U.K.
- France
- Italy
- Spain
- Russia
- Rest of Europe

•    Asia-Pacific (APAC)

- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific

•    Rest of the World (RoW)

- Brazil
- Saudi Arabia
- South Africa
- U.A.E.
- Other Countries

Frequently Asked Questions

From USD 1.7 billion in 2021, the global radiation-hardened electronics market is anticipated to grow to USD 2.1 billion by 2027, registering a CAGR of 3.6% during the forecast period 2021-2027.
Based on manufacturing techniques, the global radiation-hardened electronics market is classified into Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS)
The rising number of space missions globally, increased demand for radiation-hardened electronics in commercial and military sectors, rising number of communication satellites in the earth’s orbit will propel the growth of the radiation-hardened electronics market.
North America contributes to the largest market share in the radiation-hardened electronics market owing to the presence of major industry players and prominent space and defense institutes in the region
Some of the major players in the global Radiation-Hardened Electronics market include Microchip Technology Inc., BAE Systems, Infineon Technologies AG, STMicroelectronics, Renesas Electronics Corporation, Honeywell International Inc., Advanced Micro Devices, Inc (Previously known as Xilinx Incorporation), Texas Instruments Incorporated, Analog Devices, Inc., and Teledyne Technologies Inc.

Place an order

Research Methodology

  •  Desk Research / Pilot Interviews
  •  Build Market Size Model
  •  Research and Analysis
  •  Final Deliverabvle

CONNECT WITH OUR SALES TEAM