Press Releases

The global radiation-hardened electronics market is projected to grow at a 3.6% CAGR during 2021-2027. To protect devices and systems from the effects of radiation, industries utilize radiation-hardened electronics and are generally employed in high-altitude applications where factors such as radiation may cause electronic components to malfunction. In military and space applications, radiation-tolerant components are frequently used in applications such as satellite system power supplies, switching regulators, and microprocessors. The rising number of space missions globally, increased demand for radiation-hardened electronics in commercial and military sectors, rising number of communication satellites in the earth’s orbit will propel the growth of the radiation-hardened electronics market. Furthermore, growing intelligence, surveillance, and reconnaissance (ISR) applications along with a surge in demand for radiation-hardened electronics in the communication satellite segment and electronics systems, will propel the radiation-hardened electronics market forward.

In January 2022, BAE Systems has been awarded a $60 million contract by Army Contracting Command-Rock Island to create next-generation, radiation-hardened by design microelectronics. The contract's efforts could lead to better access to more advanced process nodes for the US defense and aerospace communities in the future. The program's principal purpose is to provide the US government and aerospace sector with onshore access to cutting-edge microelectronics technology.

The COVID-19 pandemic has led to tension in China-US trade, resulting in impacting imports of radiation-hardened electronics in the US. The United States and Europe are the two most important importers of semiconductor components. The makers of radiation-hardened electronics in the United States and Europe are being harmed by high import tariffs on radiation-hardened electronic components in these locations, as well as supply chain interruptions. This could lead to a supply-demand mismatch, which would have a detrimental influence on market growth. The market, on the other hand, is anticipated to rebound slowly.

Browse 73 market data Tables and 47 Figures spread through 300 Pages and in-depth TOC on " Radiation-Hardened Electronics Market by Product Type (Custom-Made and Commercial-off-the-Shelf), by Material Type (Silicon, Hydrogenated Amorphous Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, and Others), by Component (Memory, Logic, Power Management, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog & Digital Mix Signals, and Controllers & Processors), by Manufacturing Techniques (Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS)), by Application (Space, Aerospace & Defense, Nuclear Power Plants, Commercial Satellites, Medical, and Others), and Region - Global Forecast to 2027"

By Application, space segment contributes to the largest share in the market.

In the approaching years, the space application is predicted to have the largest market share. It's due to the rising demand for radiation-hardened electronics for TV transmission, telephone satellites, nano- and microsatellites, and other applications, as well as the growing worldwide demand for earth observation satellites, space-based military, and agriculture surveillance and monitoring. For electronic components used in space-based applications, radiation shielding is a critical design consideration.

Global Radiation-Hardened Electronics Market Segmentation Analysis

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“Asia-Pacific is anticipated to have a high CAGR in the Radiation-Hardened Electronics Market during 2021-2027.”

APAC is anticipated to have a high CAGR during 2021-2027 owing to the innovative radiation-hardened technologies in the manufacturing and growing economic conditions in China, India, and Japan. Furthermore, the rising space and R&D activities in countries like India and China will propel the growth in the region.

Some of the major players in the global Radiation-Hardened Electronics market include Microchip Technology Inc., BAE Systems, Infineon Technologies AG, STMicroelectronics, Renesas Electronics Corporation, Honeywell International Inc., Advanced Micro Devices, Inc (Previously known as Xilinx Incorporation), Texas Instruments Incorporated, Analog Devices, Inc., and Teledyne Technologies Inc.

Scope of the Report

Global Radiation-Hardened Electronics Market Coverage

Product Type Insight and Forecast 2015-2027

• Custom-Made
• Commercial-off-the-Shelf

Material Type Insight and Forecast 2015-2027

• Silicon
• Hydrogenated Amorphous Silicon
• Silicon Carbide
• Gallium Nitride
• allium Arsenide
• Others

Component Insight and Forecast 2015-2027

• Memory
• Logic
• Power Management
• Field-Programmable Gate Array
• Application Specific Integrated Circuit
• Analog & Digital Mix Signals
• Controllers & Processors

Manufacturing Techniques Insight and Forecast 2015-2027

• Radiation-Hardening-By-Design (RHBD)
• Radiation-Hardening-By-Process (RHBP)
• Radiation-Hardening-By-Software (RHBS)

Application Insight and Forecast 2015-2027

• Space
• Aerospace & Defense
• Nuclear Power Plants
• Commercial Satellites
• Medical
• Others

Geographical Segmentation

Radiation-Hardened Electronics Market by Region

North America

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – U.S., Canada, and Mexico

Europe

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – Germany, U.K., France, Italy, Spain, Russia, and Rest of Europe

Asia-Pacific (APAC)

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – China, Japan, India, South Korea, and Rest of Asia-Pacific

Rest of the World (RoW)

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – Brazil, Saudi Arabia, South Africa, U.A.E., and Other Countries