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The global radiation-hardened electronics market is projected to grow at a 3.6% CAGR during 2023-2030. To protect devices and systems from the effects of radiation, industries utilize radiation-hardened electronics and are generally employed in high-altitude applications where factors such as radiation may cause electronic components to malfunction. In military and space applications, radiation-tolerant components are frequently used in applications such as satellite system power supplies, switching regulators, and microprocessors. The rising number of space missions globally, increased demand for radiation-hardened electronics in commercial and military sectors, rising number of communication satellites in the earth’s orbit will propel the growth of the radiation-hardened electronics market. Furthermore, growing intelligence, surveillance, and reconnaissance (ISR) applications along with a surge in demand for radiation-hardened electronics in the communication satellite segment and electronics systems, will propel the radiation-hardened electronics market forward.

The radiation-hardened electronics market refers to the industry involved in the development, production, and deployment of electronic components and systems that are designed to withstand the effects of radiation in harsh environments, such as outer space, nuclear power plants, and high-altitude applications.

Radiation can cause various detrimental effects on electronic devices, including ionizing radiation-induced errors, single-event upsets (SEUs), latch-ups, and total dose effects. Radiation-hardened (rad-hard) electronics are specifically designed and manufactured to minimize or eliminate these effects, ensuring reliable operation in radiation-rich environments.

Here are key aspects of the radiation-hardened electronics market:

Components: Radiation-hardened electronic components include microprocessors, memory devices, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), analog and digital integrated circuits (ICs), sensors, and power management devices. These components are designed using specialized processes and materials to withstand radiation effects.

Design Techniques: Radiation-hardened electronic systems employ various design techniques to mitigate the effects of radiation. Redundancy, error correction codes (ECC), triple modular redundancy (TMR), and radiation-hardened-by-design (RHBD) approaches are commonly used to enhance system reliability and reduce the susceptibility to radiation-induced errors.

Applications: The radiation-hardened electronics market serves a wide range of applications. Some notable examples include space exploration and satellites, military and defense systems, nuclear power plants, high-energy physics experiments, aviation and aerospace systems, and medical devices used in radiation therapy.

Standards and Certifications: Various standards and certifications ensure the reliability and performance of radiation-hardened electronics. Organizations such as the Defense Logistics Agency (DLA), National Aeronautics and Space Administration (NASA), and the European Space Agency (ESA) set standards and conduct assessments to qualify components and systems for radiation-hardened applications.

Technologies: Radiation-hardened electronics are developed using advanced semiconductor fabrication processes, such as silicon-on-insulator (SOI) and silicon germanium (SiGe), which provide enhanced radiation tolerance compared to conventional processes. Additionally, specialized packaging and shielding techniques are employed to protect electronic components from radiation.

In January 2022, BAE Systems has been awarded a $60 million contract by Army Contracting Command-Rock Island to create next-generation, radiation-hardened by design microelectronics. The contract's efforts could lead to better access to more advanced process nodes for the US defense and aerospace communities in the future. The program's principal purpose is to provide the US government and aerospace sector with onshore access to cutting-edge microelectronics technology.

The COVID-19 pandemic has led to tension in China-US trade, resulting in impacting imports of radiation-hardened electronics in the US. The United States and Europe are the two most important importers of semiconductor components. The makers of radiation-hardened electronics in the United States and Europe are being harmed by high import tariffs on radiation-hardened electronic components in these locations, as well as supply chain interruptions. This could lead to a supply-demand mismatch, which would have a detrimental influence on market growth. The market, on the other hand, is anticipated to rebound slowly.

Browse 73 market data Tables and 47 Figures spread through 300 Pages and in-depth TOC on " Radiation-Hardened Electronics Market by Product Type (Custom-Made and Commercial-off-the-Shelf), by Material Type (Silicon, Hydrogenated Amorphous Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, and Others), by Component (Memory, Logic, Power Management, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog & Digital Mix Signals, and Controllers & Processors), by Manufacturing Techniques (Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS)), by Application (Space, Aerospace & Defense, Nuclear Power Plants, Commercial Satellites, Medical, and Others), and Region - Global Forecast to 2030"

By Application, space segment contributes to the largest share in the market.

In the approaching years, the space application is predicted to have the largest market share. It's due to the rising demand for radiation-hardened electronics for TV transmission, telephone satellites, nano- and microsatellites, and other applications, as well as the growing worldwide demand for earth observation satellites, space-based military, and agriculture surveillance and monitoring. For electronic components used in space-based applications, radiation shielding is a critical design consideration.

Global Radiation-Hardened Electronics Market Segmentation Analysis

Segment	Categorization	Leading Category
Product Type	Custom-Made and Commercial-off-the-Shelf	Commercial-off-the-Shelf (Fastest)
Material Type	Silicon, Hydrogenated Amorphous Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, and Others	Silicon  (Significant Growth)
Component	Memory, Logic, Power Management, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog & Digital Mix Signals, and Controllers & Processors	Power Management (Steady Growth)
Manufacturing Techniques	Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS)	Radiation-Hardening-By-Design (Significant Growth)
Application	Space, Aerospace & Defense, Nuclear Power Plants, Commercial Satellites, Medical, and Others	Space (Largest)
Region	North America, Europe, Asia-Pacific, and Rest of the World	North America (Largest) Asia-Pacific (High CAGR)

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“Asia-Pacific is anticipated to have a high CAGR in the Radiation-Hardened Electronics Market during 2023-2030.”

APAC is anticipated to have a high CAGR during 2023-2030 owing to the innovative radiation-hardened technologies in the manufacturing and growing economic conditions in China, India, and Japan. Furthermore, the rising space and R&D activities in countries like India and China will propel the growth in the region.

Some of the major players in the global Radiation-Hardened Electronics market include Microchip Technology Inc., BAE Systems, Infineon Technologies AG, STMicroelectronics, Renesas Electronics Corporation, Honeywell International Inc., Advanced Micro Devices, Inc (Previously known as Xilinx Incorporation), Texas Instruments Incorporated, Analog Devices, Inc., and Teledyne Technologies Inc.

Scope of the Report

Report Metric	Details
Market Size Available for the Years in the Study	2018–2030
Historical Period	2018–2022
Base Year	2022
Forecast Period	2022–2030
Segments Covered in the Study	Product Type, Material Type, Component, Manufacturing Technique, Application, and Region
Geographies Covered in the Study	North America (U.S., Canada, Mexico), Europe (Germany, U.K., France, Italy, Spain, Russia), Asia-Pacific (China, Japan, India, South Korea), and Rest of the World (Brazil, Saudi Arabia, South Africa, U.A.E.)
Companies Covered in the Study	Microchip Technology Inc., BAE Systems, Infineon Technologies AG, STMicroelectronics, Renesas Electronics Corporation, Honeywell International Inc., Advanced Micro Devices, Inc (Previously known as Xilinx Incorporation), Texas Instruments Incorporated, Analog Devices, Inc., and Teledyne Technologies Inc.

Global Radiation-Hardened Electronics Market Coverage

Product Type Insight and Forecast 2018-2030

• Custom-Made
• Commercial-off-the-Shelf

Material Type Insight and Forecast 2018-2030

• Silicon
• Hydrogenated Amorphous Silicon
• Silicon Carbide
• Gallium Nitride
• allium Arsenide
• Others

Component Insight and Forecast 2018-2030

• Memory
• Logic
• Power Management
• Field-Programmable Gate Array
• Application Specific Integrated Circuit
• Analog & Digital Mix Signals
• Controllers & Processors

Manufacturing Techniques Insight and Forecast 2018-2030

• Radiation-Hardening-By-Design (RHBD)
• Radiation-Hardening-By-Process (RHBP)
• Radiation-Hardening-By-Software (RHBS)

Application Insight and Forecast 2018-2030

• Space
• Aerospace & Defense
• Nuclear Power Plants
• Commercial Satellites
• Medical
• Others

Geographical Segmentation

Radiation-Hardened Electronics Market by Region

North America

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – U.S., Canada, and Mexico

Europe

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – Germany, U.K., France, Italy, Spain, Russia, and Rest of Europe

Asia-Pacific (APAC)

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – China, Japan, India, South Korea, and Rest of Asia-Pacific

Rest of the World (RoW)

• By Product Type
• By Material Type
• By Component
• By Manufacturing Technique
• By Application
• By Country – Brazil, Saudi Arabia, South Africa, U.A.E., and Other Countries