Status : Published Published On : May, 2023 Report Code : VRSME9106 Industry : Semiconductor & Electronics Available Format : Page : 300
2025
2030

Global Radiation-Hardened Electronics Market – Analysis and Forecast (2025-2030)

Industry Insight by Product Type (Custom-Made and Commercial-off-the-Shelf), by Material Type (Silicon, Hydrogenated Amorphous Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, and Others), by Component (Memory, Logic, Power Management, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog & Digital Mix Signals, and Controllers & Processors), by Manufacturing Techniques (Radiation-Hardening-By-Design (RHBD), Radiation-Hardening-By-Process (RHBP), and Radiation-Hardening-By-Software (RHBS)), by Application (Space, Aerospace & Defense, Nuclear Power Plants, Commercial Satellites, Medical, and Others), and Geography (U.S., Canada, Germany, U.K., France, China, Japan, India, and Rest of the World)

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Research Methodology

  •  Desk Research / Pilot Interviews
  •  Build Market Size Model
  •  Research and Analysis
  •  Final Deliverabvle

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